In the past year or two, the application potential of MIP packaging technology has further gained recognition in the industry chain and market. Relevant manufacturers continue to drive cost reduction and efficiency improvement of MIP packaging products through innovation, and launch products that are more suitable for downstream manufacturing and better meet market demand.
The exhibits at this year's ISLE exhibition reflect a significant increase in manufacturers deploying MIP technology and MIP display products. For example, Lehman Optoelectronics, which had previously focused on COB packaging technology, also launched MIP display screens for the first time. In terms of technological trends, the modularization trend of MIP technology is also evident, which is not only conducive to reducing the cost of MIP systems, but also a major advantage for downstream display screen manufacturers to lay out MIP technology routes.
A specific example of MIP technology modularization can refer to the products of TBC LED. On April 29th, the company officially released the MIP panel AS series, which adopts a triple technology fusion solution of "MIP+module+GOB". The core advantages mainly include three aspects:
GOB: Simplify the existing molded packaging form to GOB packaging, optimize the structure and cost;
Integration: The AS series MIP panel adopts an integrated process flow, reducing process steps, lowering lamp bead standards, optimizing more structures, and achieving better display effects and reliability;
Customization: The lamp beads of the AS series MIP panel can be customized according to needs, and the combination of modules can match more diverse structures and application scenarios. It has advantages in color gamut and differentiation, and is more suitable for the ever-changing market environment in the future.
TBC LED stated that this series of products is mainly aimed at the micro pitch display market below P1.2, which can meet the dual requirements of image quality accuracy and spatial adaptability in the era of 4K/8K ultra high definition display.
According to LEDinside, MIP technology is still in the early stages of mass production, and its cost advantage is not yet significant in the short term. But with the continuous exploration of packaging manufacturers in technological innovation, the cost advantage of MIP technology is gradually emerging in every aspect from chips, packaging to display screens.
In the chip stage, MIP is a chip level packaging that supports the use of constantly shrinking chips. Due to the small size of the chips, the utilization rate per unit wafer is greatly improved, which means a reduction in the cost of the chip stage.
In the packaging process, the selection of substrates is more flexible and the precision requirements are not high, which can solve the process difficulties between chips and display panels. The yield requirements for large-scale transfer are also reduced, which is equivalent to reducing production costs.
On this basis, by adopting integrated and GOB packaging, MIP's advantages in image quality, reliability, and cost are further highlighted. Taking the GOB (Glue on Board) process as an example, after bonding the LED beads to the PCB board, a layer of black optical adhesive is applied to convert the original point light source into a surface light source. This improves the uniformity and color contrast of the display screen. In addition, the increased protection and reliability of the product is equivalent to reducing the maintenance cost of the backend and extending the product's lifespan. The overall cost-effectiveness of MIP panels can be seen from this.
In the true Micro LED chip level MIP packaging process, traditional SMT equipment from display manufacturers is difficult to be compatible. However, if packaging manufacturers ship in the form of MIP panels/modules, it solves this problem for display manufacturers and saves the cost of adding new equipment.
Overall, under the trend of modularity, MIP technology is expected to accelerate its penetration into downstream markets, helping LED display manufacturers expand their application boundaries and thereby increase the market size of LED displays
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